Testing

SG Industries offers a full suite of Test Services through our qualified testing partners as shown below. Test services are quoted to our customer on a case by case basis due to the variances in the types of products to be tested and types of testing required by each customer.

Component Testing from Category 1 through Category 22

Category Test Type
01 - Group A Electrical Test Per Device Datasheet @ MIL-Temps (-55C,+25C,+125C)
01A - Group A Electrical Test Per device Datasheet @ OPERATING TEMPS
01B - Group A Per MIL-PRF-19500/Sheet DC Tests Subgroup -1: Visual & Mechanical
Inspection Subgroup -2: TA=+25C Subgroup- 3: TA = Hot & Cold
01C - DC Electrical Test Per Device Datasheet @ +25C
01D - DC & Functional Test Per Device Datasheet @+25C
01E - AC / DC & Functional Electrical Test Industrial Temps (-40C, +25C, +85C)
02 - Solder-ability Test Per J-STD-002C, CATEGORY (Category 3, 8 hrs Steam Aging) 3 units / DC
02A - Solder-ability Test Per J-STD-002C, CATEGORY(Category 1, 0 hrs Aging) 3 units / DC
02B - XRF TEST To Detect Lead Material For Leaded or Non-Leaded (Rohs)
03 - AC, DC & Functional Per Device Datasheet at (TA =+25C)
04 - Solder tinning Per J-STD-001
05 - Dry Bake / Moisture Sensitive Packaging Per J-STD-033, EIA-583 PEMS MLS = 3
06 - X-ray Per Applicable MIL-Spec-Method (2 Views)
07 - Tape Reel Per EIA-481(SMD) or EIA-296F(AXIAL)
07A - De-Reel
08 - De-Lid Die- Marking Verification (1 unit from a single date-code lot) Destructive Test
08A - Internal Visual Per MIL Applicable / MIL Standard Workmanship
09 - Resistance Tolerance @ +25C
09A - DWV (dielectric withstanding voltage) +25C
10 - Capacitance Tolerance and DF @ +25C
10A - DWV (dielectric withstanding voltage) +25C
10B - Insulation Resistance and/or Leakage test +25C
11 - DC Characteristics (diode & trans) TA =+25c
12 - Special Test
13 - (RTS) Swab Testing – Performed by SGI Quality Assurance Team
14 & 14A - Physical Dimensions - 100% Visual Inspection and Sample Mechanical Dimensions –
Performed by SGI Quality Assurance Team
15 - PIND Micro (883-2020) or Semi (750-2052), Cond-A
16 - SEAL (hermeticity) Micro (883-1014), Semi (750-1071)
17 - PIND TEST per applicable Mil-Std Microcircuits Mil-Std-883, Method-2020, Cond-A,
Semiconductors Mil-Std-750, Method-2052, Cond-A
18 -

Limited Test - See Below at (TA =+25C)
Device will be exercised for programmability only using a Programmer

  1. Program with a pattern
  2. Bake for 24 hours and verify at VCC-Min/Max 
  3. Erase and blank test
19A - Counterfeit: Visual & Mechanical Performed by SGI Quality Assurance Team
19B -

Counterfeit: Electrical Gross Fails testing only:

  • Testing includes: continuity test, opens & shorts test, Current test and I/O Leakage testing only.
  • Functional Test from Known Good part learned-mode
20 -

Memory: PROM, EPROM, EEPROM, FLASH Memory Programming Services

  • Verify blank state(erase if required or possible)
  • Load customer file into programmer buffer & verify checksum
  • Program devices and verify at both VCC low and VCC High
  • Place label with programmed part number or mark with ink-mark
21 -

EPROM, EEPROM, FLASH, Microcontroller

  • Verify blank state (erase if required or possible)
  • Load Pattern file into programmer buffer & verify checksum
  • Program devices and verify at both VCC low and VCC High
  • Erase devices and perform Blank Test
22 - Burn-In per Applicable MIL-Spec.